Taiwan broke ground in Kaohsiung on an advanced semiconductor packaging park where TSMC plans a technology-validation laboratory and a talent-training center. The two facilities are expected to begin operating in the fourth quarter of 2029. Advanced packaging has become increasingly important as leading chips combine multiple specialized dies. The project is intended to strengthen validation capacity, develop skilled workers, and reinforce Taiwan's central role in the semiconductor supply chain.
Source: https://www.reuters.com/world/asia-pacific/taiwan-breaks-ground-advanced-packaging-park-anchored-by-tsmc-2026-09-21/
